11th Global Virtual Summit on Materials Science & Engineering

11th Global Virtual Summit on Materials Science & Engineering

Dec 19 - 20, 2026
🇬🇧 United Kingdom
Online
Abstract Deadline: Dec 16, 2026
About This Conference
Researcher Meetings is organizing “11th Global Virtual Summit on Materials Science & Engineering” which will be held on December 19-20, 2026. Materials Science 2026 Forum will provide an opportunity for researchers, practitioners, and educators with a leading interdisciplinary platform to introduce and address the latest developments, trends, and concerns, as well as real challenges faced and strategies implemented in the fields of materials science, technology and engineering. It dedicated to creating a stage for exchanging the latest research results and sharing the advanced research methods. Join us to Gain access to cutting-edge research at your place during the meeting with phenomenal talks planned like the Keynote session, Oral session, Poster Presentation and networking. The conference believes in the principle of sustainable growth for a better tomorrow.
Call for Papers
Theme: New Insights, and Cutting-Edge Technologies in Materials Science and Engineering,Kindly share the following details to finalize your speaker profile and program slot:
— Title of Presentation
— Abstract (300–350 words)
— Short Biography (100–150 words)
— Complete Affiliation Details
Details
Start Date Dec 19, 2026
End Date Dec 20, 2026
Deadline Dec 16, 2026
CfP Dates
Abstract Deadline Dec 14, 2026
Format Online
Acceptance Rate 100% Moderate
Indexing
✓ Scopus ✓ WoS ✓ Ei CORE A*
Views 2
Submit Paper Submit Your Paper
Keynote Speakers
• https://materials.researchermeetings.com/speakers/
Registration
RegularEUR 99
Student49
Online99
Get Updates

Be notified if the deadline is extended, dates change, or important updates are posted.

Share
Manage Your Conference

Need a platform for paper submissions, peer reviews, and scheduling?

Try SharpConference

Reviews

Log in to leave a review for this conference.

No reviews yet. Be the first to review this conference!